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Eoptolink Demos Its NX200 and NX300 Series Optical Circuit Switching (OCS) Solution at OFC 2026

LOS ANGELES, Calif., March 16, 2026 – Eoptolink Technology Inc., Ltd., a global leader and innovator in advanced optical interconnect solutions, today announced that it will unveil its new Optical Circuit Switch (OCS) products at OFC 2026.

As AI models scale to trillions of parameters, the underlying network infrastructure must evolve to support massive, predictable data flows across thousands of GPUs. In traditional electrical packet switch (EPS)-only networks, spine-layer switches can become a performance bottleneck. One deployment approach is to replace the spine-layer EPS with OCS, thereby increasing overall network throughput and enabling easy scaling of AI cluster sizes.

Eoptolink Unveils High-Density 6.4T NPO Solution at OFC 2026

LOS ANGELES, Calif., March 13, 2026 – Eoptolink Technology Inc., Ltd., a global leader and innovator in advanced optical interconnect solutions, today announced the launch of its high-density 6.4T NPO optical module at OFC 2026. Designed to meet the demanding requirements of AI data centers, the new solution delivers exceptional performance, density, and efficiency for next-generation optical interconnects.

Eoptolink’s 6.4T NPO is a high-density near-packaged optical transceiver module designed to address performance and density challenges in AI data center interconnects. The module delivers 6.4 Tbps aggregate throughput across 32 lanes operating at 200 Gbps each, leveraging advanced Silicon Photonics (SiPh) technology.

Eoptolink Demos IMDD 400G per Lambda Based 1.6T DR4 Optical Transceiver Solution at OFC 2026

LOS ANGELES, Calif., March 12, 2026 – Eoptolink Technology Inc., Ltd., a global leader and innovator in advanced optical interconnect solutions, today announced the demonstration of its next-generation IMDD 400G per-lambda based 1.6T DR4 OSFP transceiver at OFC 2026.

As AI applications expand across industries, the demand for AI infrastructure capable of supporting high-performance training and inference is driving a rapid evolution in AI cluster interconnects. This trend is reflected in the roadmap for high-speed optical transceivers, progressing toward 800G, 1.6T, and 3.2T.

Eoptolink Joins XPO MSA and Unveils Industry-First 12.8 Tbps Liquid-Cooled Pluggable Optics for AI Data Centers

LOS ANGELES, Calif., March 12, 2026 – Eoptolink Technology Inc., Ltd., a global leader and innovator in advanced optical interconnect solutions, today announced the launch of its industry-first 12.8T XPO product, a next-generation pluggable optical transceiver engineered to support a wide range of AI data center architectures, including scale-up, scale-out, and metro-reach fabrics.

Eoptolink is using Broadcom's Industry First 400G/lane Optical DSP for Next-Generation 1.6T transceivers

3nm 400G/lane technology enables best-in-class 1.6T transceivers and lays the foundation for 204.8T networks using 3.2T transceivers

PALO ALTO, Calif., March 11, 2026 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO), a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions, today announced the availability of its 3nm 400G/lane optical PAM-4 DSP, the Taurus™ BCM83640, optimized for 1.6T transceiver solutions with unprecedented bandwidth density and efficiency. The device features 400G/lane serial optical interfaces, which enable optical transceiver manufacturers to cost effectively deliver low power 1.6T pluggable modules to meet the growing bandwidth needs for AI data centers.

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